About me
I am Boyang Cheng, I received the B.S. degree in Southeast University, Nanjing, China, in 2020. I am currently pursuing the Ph.D. degree in Electrical Engineering at the University of Notre Dame. My research lies at the intersection of digital and analog/mixed-signal circuit design, with a focus on developing energy-efficient and explainable/trustworthy hardware systems. In 2024, I interned at Samsung working on SRAM design, and in 2025, I focused on design technology co-optimization (DTCO).
With a background in both digital and analog/mixed-signal design, I enjoy tackling challenges that require cross-domain thinking and collaboration. My long-term goal is to advance hardware platforms that empower the next generation of intelligent, reliable, and resource-efficient technologies.
Fun Fact: I am the first student of my advisor.
What i'm doing
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Hardware Security
Physical Unclonable Functions (PUFs) and Federated Learning (FL)
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Explainable/Trustworthy Design
Circuit design for explainable AI on Bio-medical Devices and Autonomous Driving
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Stochastic Computation
Compute in Entropy (CIE): Utilize process variation for high energy-efficient computation
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RISC-V
Lightweigh RV32I RISC-V core for chip testing
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